Encapsulation Resins Market Progresses for Huge Profits During 2026
As
the need for mechanical protection of insulated printed circuit
boards continue to increase, manufacturers are looking for lucrative
options for encapsulating electronic products. Significant
environmental challenges including general contamination, vibration,
moisture and physical or thermal shock can disrupt the functioning of
the electronic components and the printed circuit boards. Growing
need for protecting the printed circuit boards has led to surge in
demand for the encapsulation resins globally. Application of resins
encapsulates the entire device, which forms a complete barrier from
extreme environment conditions in order to offer superior
performance.
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According
to Transparency Market Research, the global market of encapsulation
resins is expected to represent a value of over US$ 3,700 Mn by the
end of 2026.
Electronic
Industry to Impact Global Market Growth
With
rapid expansion in the electronic industry, demand for the printed
circuit boards in range of industrial, domestic, military and
automotive products continues to increase. Growing need to ensure the
dependability of critical devices has led the manufacturers to opt
for the enhanced protective solutions such as encapsulation resins.
Moreover, increasing number of potential requirements within the LED
electronic products will further continue to rev up demand for the
encapsulation resins in the electronic industry.
Application
in Marine Products to Boost Sales
Growing
need to protect the marine products from exposure to salt water is
expected to boost sales of encapsulation resin products. Production
of electronic devices for application in marine environment has led
the manufacturers to focus on opting for innovative protection
solutions such as epoxy resins. Manufacturers of the electronic
devices for marine environment prefer using epoxy resins in order to
protect the LED lights on the ship decks, under-water cable jointing
and protection of sensor devices. These factors are expected to
contribute towards the global market growth of encapsulation resins
significantly during the forecast period.
Potting
Compounds to Underscore Lucrative Growth Opportunities
As
the need to protect the sensitive electronic components of products
increases, manufacturers are focusing on implementing potting resins.
Attributed to dielectric properties, thermal conductivity, mechanical
strength, hardness, chemical resistance and shock resistance,
preference for potting compounds will continue to remain high while
manufacturing electronic products. Increasing production of
electronic devices among the original equipment manufacturers is
further expected to impact the global market growth of encapsulation
resins positively.
Research
and Development to Fuel Demand
Demand
for the encapsulation resins is also expected to remain high
attributed to surge in the research and development activities
undertaken by the leading organizations and companies globally.
Growing advancements in development of sensors for medical and
research purposes has escalated demand for encapsulation resins. In
order to offer enhanced and uninterrupted connectivity in the
electronic products, manufacturers are focusing on developing
innovative solutions such as smart passive sensors. Surge in demand
for sensor products that offers prolonged services has led
manufacturers of the electronic products to implement protective
solutions such as encapsulating electronic components in resins.
Moreover, as sensor devices translate the environmental and physical
characteristics into electrical signal, demand for resins is expected
to remain high.
Electronics
& Electrical Components to Represent a Leading Segment
As
the need to protect various electronic products against corrosion in
the industrial environment arises, demand for epoxy resins is
expected to remain high globally. On the basis of product type, the
epoxy resins segment is expected to witness significant revenue
growth, recording for a value of over US$ 1,000 Mn by the end of
2026. In contrary, the other resins product type segment is expected
to register a robust CAGR during the forecast period.
Based
on end use industries, the electronics & electrical components
segment is expected to represent the highest revenue growth,
accounting for a value of over US$ 900 Mn by the end of 2017. On the
contrary, the others end use industries segment is expected to
register a significant CAGR throughout the forecast period.
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Competition
Tracking
Leading
market players operating in the global market of encapsulation resins
include Shin-Etsu Chemical Co. Ltd., Fuji Chemical Industrial Co.,
Ltd., Master Bond Inc., H. B. Fuller Company, Huntsman Corporation,
Hitachi Chemical, Henkel ag & co. kgaa, Dow Chemical Company and
ACC Silicones Ltd., BASF.
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Email: sales@transparencymarketresearch.com
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